Silicone-Free Heat Sink Compound

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1978-DP Silicone-Free Heat Sink Comp - 4oz 4 oz 24 $798.72
1978-1 Silicone-Free Heat Sink Comp - 1 lb 1 lb 12 $873.96
Packaging Order minimum case quantity only. Extra shipping fees may apply.
Silicone-Free Heat Sink Compound draws heat away when applied to a component.
Also known as thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material.

In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.
 
Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.

Features & Benefits

  • Thermal conductivity - 0.92 W/m-K
  • Functional temperature range -40°F to 392°F (-40°C to 200°C)
  • Non-ozone depleting
  • Avoid solder defects due to silicon contamination
  • Easy application
  • Will not separate
  • Will not harden and crack

Articles

How Heat Sink Compound Keeps Electronics Cool
What is heat sink compound? Heat sink compound (also called thermal grease, thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material) is a sticky paste that's used as an interface between CPU heat sinks and heat sources. What is the purpose of he...
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