Heat Sink Compound

Increase Thermal Dissipation and Improve Interface with Mechanical Heat Sink

Heat sink compound, which is also called thermal grease, thermal paste, thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material, is designed to efficiently transfer heat away from a heat-generating component. For electrical applications, heat sink compound is used to thermally bond a component with a mechanical heat sink. The compound fills the gap between the CPU (central processing unit) or other heat generating components.

In addition, heat sink paste is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Although heat sink paste does not have the thermal conductivity of metals like copper and silver, the improvement over the air will increase thermal responsiveness.