Blog/News

3M Novec Replacements: Infographic Guide
On December 20, 2022, 3M announced their plans to phase-out their Novec PFAS-based product lines by the end of 2025. At Techspray, our focus is on high-precision cleaning chemistries, which include chemical next...
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How Clean is Clean? Ultimate Guide to PCB Cleanliness Testing
The increased miniaturization in modern electronics has been continuously reducing the pitch between conductors and increasing the probability of electrochemical migration of contamination in class 3 electronic next...
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Cleaning Challenges When Machining Medical Implants
The medical industry has exploded in recent decades with new technologies, new materials, and new capabilities, and we have benefited in both quality and duration of life. One of these many advances entails next...
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Overcoming the Challenges of Cleaning with Water-Based Chemistries
Precise cleaning has become the Key Performance Indicator (KPI) to the reliability of today’s sophisticated electronics packages. Increased miniaturization, reduced standoff heights, and the transition next...
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Preventing PCB Misprints with Optimized Stencil Cleaning Process
The consumer demand for compact, miniaturized, and smart electronic devices is making electronics manufacturers use the smallest available packaging footprints. As a result, Printed Circuit Board Assemblies next...
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3M Announcement of Novec Phase-Out… What Does It Mean?
On December 20, 2022, 3M announced their plans to phase-out their Novec PFAS-based product lines by the end of 2025: “3M today announced it plans to exit per- and polyfluoroalkyl substance (PFAS) next...
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Techlab Inhouse Cleaning, Coating, and Analytics Lab
TECHSPRAY COMBINES OVER 30 YEARS OF EXPERIENCE DEVELOPING HIGH PRECISION CLEANERS AND CONFORMAL COATINGS, GIVING US A UNIQUE PERSPECTIVE OF THESE INTERRELATED PROCESSES. Techspray’s TechLab offers next...
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Guide to Manufacturing ESD-Safe 3D Printed Parts
Electrical and mechanical failures are the most common failure modes encountered in Printed Circuit Boards (PCBs). Another not-so-obvious failure mode that can cause catastrophic failures in electronic next...
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Preventing the Destructive Power of Conductive Anodic Filament (CAF) Growth
Electrical and mechanical failures are the most common failure modes encountered in Printed Circuit Boards (PCBs). Another not-so-obvious failure mode that can cause catastrophic failures in electronic next...
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The Essential Guide to Waterproofing Electronics
The current development in technology has forced electronics to move out of offices and face environmental conditions in outdoor locations. Among all environmental factors, moisture is the cause of a vast next...
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